CAPEL FPC & Flex-Rigid PCB Production Agbara
| Ọja | Iwọn iwuwo giga | |||
| Asopọmọra (HDI) | ||||
| Standard Flex iyika Flex | Alapin Rọ iyika | Kosemi Flex Circuit | Membrane Yipada | |
| Standard Panel Iwon | 250mm X 400mm | Eerun fomat | 250mmX400mm | 250mmX400mm |
| iwọn ila ati Aye | 0.035mm 0.035mm | 0.010"(0.24mm) | 0.003"(0.076mm) | 0.10"(.254mm) |
| Sisanra Ejò | 9um/12um/18um/35um/70um/100um/140um | 0.028mm-.01mm | 1/2 iwon.ati ki o ga | 0.005"-.0010" |
| Iwọn Layer | 1-32 | 1-2 | 2-32 | 1-2 |
| Nipasẹ / lu iwọn | ||||
| kere lu ( darí ) Iho opin | 0.0004" (0.1 mm) 0.006" (0.15 mm) | N/A | 0.006" (0.15 mm) | 10 mil (0.25 mm) |
| O kere Nipasẹ (Lasa) Iwọn | 4 mil (0.1mm) 1 mil (0.025 mm) | N/A | 6 mil (0.15 mm) | N/A |
| Kere Micro Nipasẹ (Lasa) Iwon | 3 mil (0.076 mm) 1 mil (0.025 mm) | N/A | 3 mil (0.076 mm) | N/A |
| Ohun elo Stiffener | Polyimide / FR4 / Irin / SUS / Alu | PET | FR-4 / Poyimide | PET / Irin / FR-4 |
| Ohun elo Idabobo | Ejò / fadaka Lnk / Tatsuta / Erogba | Fadaka bankanje / Tatsuta | Ejò / Silver Inki / Tatduta / Erogba | Fadaka bankanje |
| Ohun elo Irinṣẹ | 2 mil (0.051 mm) 2 mil (0.051 mm) | 10 mil (0.25mm) | 2 mil (0.51 mm) | 5 mil (0.13 mm) |
| Zif Ifarada | 2 mil (.051 mm) 1 mil (0.025 mm) | 10 mil (0.25mm) | 2 mil (0.51 mm) | 5 mil (0.13 mm) |
| boju-boju SOlder | ||||
| Solder Boju Bridge Laarin Dam | 5 mil (.013 mm) 4 mil (0.01mm) | N/A | 5 mil (0.13 mm) | 10 mil (0.25mm) |
| Ifarada Iforukọ Solder Boju | 4 mil (.010 mm) 4 mil (0.01mm) | N/A | 5 mil (0.13 mm) | 5 mil (0.13 mm) |
| IBORA | ||||
| Iforukọsilẹ Ideri | 8 mil 5 mil | 10 mil | 8 mil | 10 mil |
| Iforukọsilẹ PIC | 7 mil 4 mil | N/A | 7 mil | N/A |
| Solder boju Iforukọ | 5 mil 4 mil | N/A | 5 mil | 5 mil |
| Dada Ipari | ENIG/Fadaka Immersion/Tin Immersion/Gold Plating/Tin Plating/OSP/ ENEPIG | |||
| Àlàyé | ||||
| Igi to kere julọ | 35 mil 25 mil | 35 mil | 35 mil | Agbekọja ayaworan |
| Iwọn iwọn kekere | 8 mil 6 mil | 8 mil | 8 mil | |
| Aaye to kere julọ | 8 mil 6 mil | 8 mil | 8 mil | |
| Iforukọsilẹ | ± 5mil ± 5mil | ± 5mil | ± 5mil | |
| Ipalara | ± 10% ± 10% | ± 20% | ± 10% | NA |
| SRD (Ofin Irin Kú) | ||||
| Ifarada Ifarada | 5 mil (0.13 mm) 2 mil (0.051 mm) | N/A | 5 mil (0.13 mm) | 5 mil (0.13 mm) |
| Redio ti o kere julọ | 5 mil (0.13 mm) 4 mil (0.10 mm) | N/A | 5 mil (0.13 mm) | 5 mil (0.13 mm) |
| Inu Radius | 20 mil (0.51 mm) 10 mil (0.25 mm) | N/A | 31 mil | 20 mil (0.51 mm) |
| Punch kere Iho Iwon | 40 mil (10.2 mm) 31.5 mil (0.80 milimita) | N/A | N/A | 40 mil (1.02 mm) |
| Ifarada ti Punch Iho Iwon | ± 2mil (0.051 mm) ± 1 mil | N/A | N/A | ± 2 mil (0.051 mm) |
| Iho iwọn | 20 mil (0.51 mm) 15 mil (0.38 mm) | N/A | 31 mil | 20 mil (0.51 mm) |
| Toleranc ti iho to ìla | ± 3 mil 2 mil | N/A | ± 4 mil | 10 mil |
| Ifarada Iho eti to ìla | ± 4 mil 3 mil | N/A | ± 5 mil | 10 mil |
| Kere ti Wa kakiri lati ìla | 8 milimita 5 | N/A | 10 mil | 10 mil |
CAPEL PCB Production Agbara
| Imọ paramita | ||
| Rara. | Ise agbese | Awọn itọkasi imọ-ẹrọ |
| 1 | Layer | 1 - 60 (Layer) |
| 2 | O pọju processing agbegbe | 545 x 622 mm |
| 3 | Kekere nipọn | 4 (Layer) 0.40mm |
| 6 (Layer) 0.60mm | ||
| 8 (Layer) 0.8mm | ||
| 10 (Layer) 1.0mm | ||
| 4 | Iwọn ila to kere julọ | 0.0762mm |
| 5 | Aye to kere julọ | 0.0762mm |
| 6 | Kere darí Iho | 0.15mm |
| 7 | Iho odi Ejò sisanra | 0.015mm |
| 8 | Metallized Iho ifarada | ± 0.05mm |
| 9 | Non-metallized Iho ifarada | ± 0.025mm |
| 10 | Iho ifarada | ± 0.05mm |
| 11 | Ifarada iwọn | ± 0.076mm |
| 12 | Kere solder Afara | 0.08mm |
| 13 | Idaabobo idabobo | 1E+12Ω(deede) |
| 14 | Awo sisanra ratio | 1:10 |
| 15 | Gbona mọnamọna | 288 ℃（4 igba ni iṣẹju-aaya 10） |
| 16 | Daru ati ki o tẹ | ≤0.7% |
| 17 | Anti-itanna agbara | 1.3KV/mm |
| 18 | Agbara ti o lodi si idinku | 1.4N/mm |
| 19 | Solder koju líle | ≥6H |
| 20 | Idaduro ina | 94V-0 |
| 21 | Iṣakoso impedance | ± 5% |
CAPEL PCBA Production Agbara
| Ẹka | Awọn alaye | |
| Akoko asiwaju | 24 wakati Prototyping, akoko ifijiṣẹ ti kekere-ipele jẹ nipa 5 ọjọ. | |
| PCBA Agbara | SMT patch 2 million ojuami / ọjọ, THT 300,000 ojuami / ọjọ, 30-80 ibere / ọjọ. | |
| irinše Service | Turnkey | Pẹlu ogbo ati ki o munadoko paati iraja eto isakoso, a sin PCBA ise agbese pẹlu ga-iye owo išẹ. Ẹgbẹ kan ti awọn onimọ-ẹrọ rira ọjọgbọn ati oṣiṣẹ rira ti o ni iriri jẹ iduro fun rira ati iṣakoso awọn paati fun awọn alabara wa. |
| Kitted tabi Fipamọ | Pẹlu ẹgbẹ iṣakoso rira ti o lagbara ati pq ipese paati, Awọn alabara pese wa pẹlu awọn paati, a ṣe iṣẹ apejọ naa. | |
| Konbo | Gba awọn paati tabi awọn paati pataki ti pese nipasẹ awọn alabara. ati ki o tun irinše awọn oluşewadi fun awọn onibara. | |
| PCBA Solder Iru | SMT, THT, tabi PCBA soldering iṣẹ mejeeji. | |
| Solder Lẹẹ / Tin Waya / Tin Bar | asiwaju ati laisi asiwaju (ibaramu RoHS) awọn iṣẹ ṣiṣe PCBA. Ki o si tun pese adani solder lẹẹ. | |
| Stencil | lesa gige stencil lati rii daju wipe irinše bi kekere-pitch ICs ati BGA lati pade IPC-2 Kilasi tabi ti o ga. | |
| MOQ | 1 nkan, ṣugbọn a ni imọran awọn alabara wa lati gbejade o kere ju awọn ayẹwo 5 fun itupalẹ ati idanwo tiwọn. | |
| Iwon eroja | • Awọn paati palolo: a dara ni ibamu inch 01005 (0.4mm * 0.2mm), 0201 iru awọn paati kekere. | |
| • Awọn IC ti o ga julọ gẹgẹbi BGA: A le ṣe awari awọn paati BGA pẹlu aaye Min 0.25mm nipasẹ X-ray. | ||
| Package paati | reel, teepu gige, tubing, ati pallets fun awọn paati SMT. | |
| Yiye Oke ti Awọn Irinṣe (100FP) | Yiye ni 0.0375mm. | |
| Solderable PCB Iru | PCB (FR-4, irin sobusitireti), FPC, PCB rigid-flex, PCB Aluminiomu, HDI PCB. | |
| Layer | 1 - 30 (Layer) | |
| O pọju processing agbegbe | 545 x 622 mm | |
| Kekere nipọn | 4 (Layer) 0.40mm | |
| 6 (Layer) 0.60mm | ||
| 8 (Layer) 0.8mm | ||
| 10 (Layer) 1.0mm | ||
| Iwọn ila to kere julọ | 0.0762mm | |
| Aye to kere julọ | 0.0762mm | |
| Kere darí Iho | 0.15mm | |
| Iho odi Ejò sisanra | 0.015mm | |
| Metallized Iho ifarada | ± 0.05mm | |
| Non-metallized Iho | ± 0.025mm | |
| Iho ifarada | ± 0.05mm | |
| Ifarada iwọn | ± 0.076mm | |
| Kere solder Afara | 0.08mm | |
| Idaabobo idabobo | 1E+12Ω(deede) | |
| Awo sisanra ratio | 1:10 | |
| Gbona mọnamọna | 288 ℃（4 igba ni iṣẹju-aaya 10） | |
| Daru ati ki o tẹ | ≤0.7% | |
| Anti-itanna agbara | 1.3KV/mm | |
| Agbara ti o lodi si idinku | 1.4N/mm | |
| Solder koju líle | ≥6H | |
| Idaduro ina | 94V-0 | |
| Iṣakoso impedance | ± 5% | |
| Ọna faili | BOM, PCB Gerber, Gbe ati Gbe. | |
| Idanwo | Ṣaaju ifijiṣẹ, a yoo lo ọpọlọpọ awọn ọna idanwo si PCBA ni oke tabi ti gbe tẹlẹ: | |
| • IQC: ayewo ti nwọle; | ||
| • IPQC: ayewo inu iṣelọpọ, idanwo LCR fun nkan akọkọ; | ||
| • QC wiwo: iṣayẹwo didara deede; | ||
| • AOI: soldering ipa ti patch irinše, kekere awọn ẹya ara tabi polarity ti irinše; | ||
| • X-Ray: ṣayẹwo BGA, QFN ati awọn miiran ga konge ti wa ni farasin PAD irinše; | ||
| • Idanwo Iṣẹ: Iṣẹ idanwo ati iṣẹ ni ibamu si awọn ilana idanwo alabara ati awọn ilana lati rii daju ibamu. | ||
| Tunṣe & Atunṣe | Iṣẹ Atunṣe BGA wa le yọ kuro lailewu, ipo ti ko tọ, ati BGA ti o jẹ iro ki o tun so wọn pọ mọ PCB ni pipe. | |
