ifihan: Imọ italaya ni Automotive Electronics atiCapel ká Innovations

Bii awakọ adase ṣe dagbasoke si L5 ati ọkọ ina (EV) awọn eto iṣakoso batiri (BMS) beere iwuwo agbara ti o ga julọ ati ailewu, awọn imọ-ẹrọ PCB ibile tiraka lati koju awọn ọran to ṣe pataki:

• Gbona Runaway Ewu: Awọn chipsets ECU kọja agbara agbara 80W, pẹlu awọn iwọn otutu agbegbe ti o de 150°C
• Awọn ifilelẹ Integration 3D: BMS nilo awọn ikanni ifihan agbara 256+ laarin sisanra igbimọ 0.6mm
• Awọn Ikuna gbigbọn: Awọn sensọ adase gbọdọ koju awọn mọnamọna 20G ẹrọ
• Miniaturization ibeere: Awọn olutona LiDAR nilo awọn iwọn wiwa kakiri 0.03mm ati akopọ 32-Layer

Imọ-ẹrọ Capel, fifin awọn ọdun 15 ti R&D, ṣafihan apapọ ojutu iyipada kanga gbona elekitiriki PCBs(2.0W/mK),ga-otutu sooro PCBs(-55°C~260°C), ati32-LayerHDI sin / afọju nipasẹ ọna ẹrọ(Mikrovias 0.075mm).

Abala 1: Iyika Isakoso Gbona fun Awọn ECU awakọ adase

1.1 ECU Gbona italaya

• iwuwo ṣiṣan ooru Nvidia Orin chipset: 120W/cm²
• Awọn sobusitireti FR-4 ti aṣa (0.3W/mK) fa 35% igbẹpo chirún iwọn otutu overshoot
• 62% ti awọn ikuna ECU wa lati aarẹ aarẹ ti o fa wahala ti igbona

1.2 Imọ-ẹrọ Imudara Gbona ti Capel

Ohun elo Innovations:

• Nano-alumina fikun awọn sobusitireti polyimide (2.0 ± 0.2W/mK iṣe adaṣe igbona)
• Awọn akojọpọ ọwọn bàbà 3D (400% agbegbe itusilẹ ooru pọ si)

Ilana Breakthroughs:

• Lesa Taara Structuring (LDS) fun iṣapeye gbona awọn ipa ọna
• Iṣakojọpọ arabara: 0.15mm bàbà-tinrin pupọju + 2oz awọn fẹlẹfẹlẹ bàbà wuwo

Ifiwera Performance:

Abala 2: BMS Wiring Iyika pẹlu 32-Layer HDI Technology

2.1 Industry irora Points ni BMS Design

• Awọn iru ẹrọ 800V nilo awọn ikanni ibojuwo foliteji sẹẹli 256+
• Awọn apẹrẹ ti aṣa kọja awọn opin aaye nipasẹ 200% pẹlu aiṣedeede impedance 15%.

2.2 Awọn solusan Interconnect Dinsity giga ti Capel

Stackup Engineering:

• 1+N+1 eyikeyi-Layer HDI be (awọn fẹlẹfẹlẹ 32 ni sisanra 0.035mm)
• ± 5% iṣakoso ikọlu iyatọ (awọn ifihan agbara iyara giga 10Gbps)

Microvia ọna ẹrọ:

• 0.075mm lesa-afọju vias (12:1 abala ipin)
• <5% Oṣuwọn ofo ni fifisilẹ (IPC-6012B Kilasi 3 ti o ni ibamu)

Awọn abajade ala-ilẹ:

Abala 3: Igbẹkẹle Ayika to gaju - Awọn iṣeduro Ifọwọsi MIL-SPEC

3.1 Iṣe Awọn ohun elo ti o ga julọ

• Gilasi Iyipada otutu (Tg): 280°C (IPC-TM-650 2.4.24C)
• Iwọn otutu jijẹ (Td): 385°C (pipadanu iwuwo 5%)
• Iwalaaye mọnamọna Gbona: Awọn iyipo 1,000 (-55°C↔260°C)

3.2 Awọn Imọ-ẹrọ Idaabobo Ohun-ini

• Aso polima ti o ni pilasima (aduro fun sokiri iyọ 1,000h)
• 3D EMI cavities idabobo (60dB attenuation @10GHz)

Abala 4: Iwadi Ọran - Ifowosowopo pẹlu Global Top 3 EV OEM

4.1 800V BMS Iṣakoso Module

• Ipenija: Ṣepọ 512-ikanni AFE ni aaye 85 × 60mm
• Ojutu:
  1. 20-Layer rigid-Flex PCB (radius tẹ 3mm)
  2. Nẹtiwọọki sensọ otutu ti a fi sinu (iwọn itọka 0.03mm)
  3. Itutu agbaiye irin-mojuto agbegbe (0.15°C·cm²/W resistance igbona)

4.2 L4 Adase ase Adarí

• Awọn abajade:
  • 40% idinku agbara (72W → 43W)
  • 66% idinku iwọn la awọn aṣa aṣa
  • ASIL-D iwe-ẹri ailewu iṣẹ-ṣiṣe

Abala 5: Awọn iwe-ẹri ati Imudaniloju Didara

Eto didara Capel kọja awọn iṣedede ọkọ ayọkẹlẹ:

• Iwe-ẹri MIL-SPEC: Ni ibamu pẹlu GJB 9001C-2017
• Ibamu mọto: IATF 16949: 2016 + AEC-Q200 afọwọsi
• Idanwo Igbẹkẹle:
  • 1,000h HAST (130°C/85% RH)
  • 50G mọnamọna darí (MIL-STD-883H)

Ipari: Next-Gen PCB Technology Roadmap

Capel ń ṣe aṣáájú-ọ̀nà:

• Awọn paati palolo ti a fi sinu (30% awọn ifowopamọ aaye)
• Awọn PCB arabara Optoelectronic (pipadanu 0.2dB/cm @ 850nm)
• Awọn ọna ṣiṣe DFM ti AI-ṣiṣẹ (ilọsiwaju 15% ikore)

Kan si ẹgbẹ imọ-ẹrọ waloni lati ṣe agbero idagbasoke awọn solusan PCB ti adani fun ẹrọ itanna adaṣe atẹle-gen rẹ.