Double-Layer FR4 Tejede Circuit Boards
PCB Ilana Agbara
| Rara. | Ise agbese | Awọn itọkasi imọ-ẹrọ |
| 1 | Layer | 1 - 60 (Layer) |
| 2 | O pọju processing agbegbe | 545 x 622 mm |
| 3 | Kekere nipọn | 4 (Layer) 0.40mm |
| 6 (Layer) 0.60mm | ||
| 8 (Layer) 0.8mm | ||
| 10 (Layer) 1.0mm | ||
| 4 | Iwọn ila to kere julọ | 0.0762mm |
| 5 | Aye to kere julọ | 0.0762mm |
| 6 | Kere darí Iho | 0.15mm |
| 7 | Iho odi Ejò sisanra | 0.015mm |
| 8 | Metallized Iho ifarada | ± 0.05mm |
| 9 | Non-metallized Iho ifarada | ± 0.025mm |
| 10 | Iho ifarada | ± 0.05mm |
| 11 | Ifarada iwọn | ± 0.076mm |
| 12 | Kere solder Afara | 0.08mm |
| 13 | Idaabobo idabobo | 1E+12Ω(deede) |
| 14 | Awo sisanra ratio | 1:10 |
| 15 | Gbona mọnamọna | 288 ℃（4 igba ni iṣẹju-aaya 10） |
| 16 | Daru ati ki o tẹ | ≤0.7% |
| 17 | Anti-itanna agbara | 1.3KV/mm |
| 18 | Agbara ti o lodi si idinku | 1.4N/mm |
| 19 | Solder koju líle | ≥6H |
| 20 | Idaduro ina | 94V-0 |
| 21 | Iṣakoso impedance | ± 5% |
A ṣe Awọn igbimọ Circuit Ti a tẹjade pẹlu iriri ọdun 15 pẹlu alamọdaju wa
4 Layer Flex-kosemi Boards
8 Layer kosemi-Flex PCBs
8 Layer HDI Tejede Circuit Boards
Igbeyewo ati Ayewo Equipment
Idanwo maikirosikopu
AOI ayewo
Idanwo 2D
Idanwo Impedance
Idanwo RoHS
Flying ibere
Ayẹwo petele
Titẹ Teste
Wa Tejede Circuit Boards Service
. Pese atilẹyin imọ-ẹrọ Pre-tita ati lẹhin-tita;
. Aṣa ti o to awọn ipele 40, 1-2days Yiyara titan afọwọṣe igbẹkẹle, rira ohun elo, Apejọ SMT;
. Awọn ounjẹ si Ẹrọ Iṣoogun mejeeji, Iṣakoso ile-iṣẹ, Ọkọ ayọkẹlẹ, Ofurufu, Itanna Olumulo, IOT, UAV, Awọn ibaraẹnisọrọ ati bẹbẹ lọ.
. Awọn ẹgbẹ wa ti awọn onimọ-ẹrọ ati awọn oniwadi jẹ igbẹhin si mimu awọn ibeere rẹ ṣẹ pẹlu konge ati alamọdaju.
Double-Layer FR4 Tejede Circuit Boards applited ni wàláà
1. Pipin agbara: Pipin agbara ti PC tabulẹti gba FR4 PCB meji-Layer. Awọn PCB wọnyi jẹ ki ipa ọna ṣiṣe to munadoko ti awọn laini agbara lati rii daju awọn ipele foliteji to dara ati pinpin si ọpọlọpọ awọn paati tabulẹti, pẹlu ifihan, ero isise, iranti ati awọn modulu Asopọmọra.
2. Itọnisọna ifihan agbara: Ilọpo-Layer FR4 PCB n pese wiwọ ati ipa ọna pataki fun gbigbe ifihan agbara laarin awọn oriṣiriṣi awọn paati ati awọn modulu ninu kọnputa tabulẹti. Wọn so ọpọlọpọ awọn iyika iṣọpọ (ICs), awọn asopọ, awọn sensọ, ati awọn paati miiran, ni idaniloju ibaraẹnisọrọ to dara ati gbigbe data laarin awọn ẹrọ.
3. Iṣagbesori paati: Ilọpo-Layer FR4 PCB ti a ṣe lati gba awọn iṣagbesori ti awọn orisirisi Surface Mount Technology (SMT) irinše ni tabulẹti. Awọn wọnyi ni microprocessors, iranti modulu, capacitors, resistors, ese iyika ati awọn asopo. Ifilelẹ PCB ati apẹrẹ ṣe idaniloju aye to dara ati eto awọn paati lati mu iṣẹ ṣiṣe dara ati dinku kikọlu ifihan.
4. Iwọn ati iwapọ: Awọn PCB FR4 ni a mọ fun agbara wọn ati profaili tinrin, ṣiṣe wọn dara fun lilo ninu awọn ẹrọ iwapọ gẹgẹbi awọn tabulẹti. Awọn PCB FR4 Layer Double-Layer gba laaye fun awọn iwuwo paati nla ni aaye to lopin, ti n fun awọn aṣelọpọ laaye lati ṣe apẹrẹ awọn tabulẹti tinrin ati fẹẹrẹ laisi ibajẹ iṣẹ ṣiṣe.
5. Idiyele-owo: Ti a bawe pẹlu awọn sobsitireti PCB to ti ni ilọsiwaju, FR4 jẹ ohun elo ti o ni ifarada. Double-Layer FR4 PCBs pese a iye owo-doko ojutu fun tabulẹti awọn olupese ti o nilo lati jeki gbóògì owo kekere nigba ti mimu didara ati dede.
Bawo ni Double-Layer FR4 Print Circuit Boards mu iṣẹ ati iṣẹ ṣiṣe ti awọn tabulẹti?
1. Ilẹ ati awọn ọkọ ofurufu agbara: Meji-Layer FR4 PCBs ni igbagbogbo ni ilẹ igbẹhin ati awọn ọkọ ofurufu agbara lati ṣe iranlọwọ lati dinku ariwo ati mu pinpin agbara pọ si. Awọn ọkọ ofurufu wọnyi ṣiṣẹ bi itọkasi iduroṣinṣin fun iduroṣinṣin ifihan ati dinku kikọlu laarin awọn iyika oriṣiriṣi ati awọn paati.
2. Ti a dari impedance afisona: Ni ibere lati rii daju gbẹkẹle ifihan agbara gbigbe ati ki o gbe attenuation ifihan agbara, Iṣakoso impedance afisona ti lo ninu awọn oniru ti awọn ilopo-Layer FR4 PCB. Awọn itọpa wọnyi jẹ apẹrẹ ni pẹkipẹki pẹlu iwọn kan pato ati aye lati pade awọn ibeere ikọjujasi ti awọn ifihan agbara iyara ati awọn atọkun bii USB, HDMI tabi WiFi.
3. EMI / EMC shielding: Double-Layer FR4 PCB le lo ọna ẹrọ idabobo lati dinku kikọlu itanna (EMI) ati rii daju pe ibaramu itanna (EMC). Awọn fẹlẹfẹlẹ Ejò tabi idabobo le ṣe afikun si apẹrẹ PCB lati ya sọtọ circuitry ifura lati awọn orisun EMI ita ati ṣe idiwọ awọn itujade ti o le dabaru pẹlu awọn ẹrọ miiran tabi awọn ọna ṣiṣe.
4. Awọn ero apẹrẹ ti o ga julọ: Fun awọn tabulẹti ti o ni awọn ohun elo igbohunsafẹfẹ giga tabi awọn modulu bii asopọ cellular (LTE / 5G), GPS tabi Bluetooth, apẹrẹ ti FR4 PCB meji-Layer nilo lati ṣe akiyesi iṣẹ-igbohunsafẹfẹ giga. Eyi pẹlu ibaamu impedance, crosstalk iṣakoso ati awọn ilana ipa-ọna RF to dara lati rii daju iduroṣinṣin ifihan ti o dara julọ ati pipadanu gbigbe pọọku.
